Ultralow-power logic-in-memory devices based on ferroelectric two-dimensional electron gases
UPLIFT aims to develop a non-volatile, ultralow power logic-in-memory component using ferroelectric materials to reduce power consumption in microelectronics, supporting a new start-up for commercialization.
Projectdetails
Introduction
Microelectronics components are at the core of our modern economies. The corresponding global market is exponentially growing at an annual pace of 10-15% and should reach the trillion $ by 2030.
Technological Framework
The techno-economic framework that has been driving this industry is based on:
- Boolean logic
- von Neumann architectures (with separated computing and memory units)
- CMOS transistors
It is pictured by the famous Moore's law, describing the continuous shrinking of transistor size.
Challenges in Scaling
For years, Dennard's scaling law of power consumption provided a path to shrinking such transistors while keeping the power density constant. However, as technological nodes become today as small as tens of atoms, we are hitting fundamental limits, leading to heating and preventing this downscaling.
Energy Consumption Concerns
Simultaneously, the power consumption of information and communication technologies (ICT) represents nearly 5% of the world's energy consumption. To mitigate these civilizational issues, new devices and architectures for ICT must be invented.
Community Consensus
The consensus reached by the microelectronics community is that to reduce power consumption:
i. Memory and logic units must be brought together.
ii. The inherent nonvolatile properties of ferroic materials are a valuable asset to avoid static power consumption.
Project Proposal
UPLIFT proposes to develop the POC of a non-volatile, spin-based, ultralow power (aJ) logic-in-memory component, coined FESO, which harnesses the ferroelectric control of spin-charge interconversion discovered within the ERC FRESCO.
Technical Goals
We will pattern devices down to the 100 nm scale and aim for:
- 100 mV output voltages
- 1 ns operation speed
- Endurance > 10^9 cycles
Commercial Pathway
UPLIFT will benefit from a well-defined path towards commercial exploitation, including a decade-long collaboration between the PI and two researchers from Spintec in Grenoble. The PI is launching a start-up company that will exploit the patent portfolio filed within FRESCO.
Conclusion
This POC project will serve both as a support and a propeller for the start-up, to be created in Q1 2024.
Financiële details & Tijdlijn
Financiële details
Subsidiebedrag | € 150.000 |
Totale projectbegroting | € 150.000 |
Tijdlijn
Startdatum | 1-9-2023 |
Einddatum | 28-2-2025 |
Subsidiejaar | 2023 |
Partners & Locaties
Projectpartners
- CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRSpenvoerder
Land(en)
Vergelijkbare projecten binnen European Research Council
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
Strain-Free All Heusler Alloy JunctionsThis project aims to develop a low-power ferrimagnetic Heusler-alloy film for spintronic devices, utilizing atomic engineering to enhance magnetic properties and simplify production processes. | ERC Advanced... | € 3.108.441 | 2024 | Details |
Layering, Understanding, Controlling and Integrating Ferroelectric Polar Textures on SiliconThe project aims to integrate topological polar textures in nanoscale ferroelectrics onto silicon platforms to enable energy-efficient, ultra-compact electronic devices through advanced engineering techniques. | ERC Advanced... | € 2.499.960 | 2023 | Details |
Curvilinear multiferroicsThis project aims to develop curvilinear multiferroics by using geometric curvature to create new materials for energy-efficient computing, enhancing memory and logic devices beyond current technologies. | ERC Advanced... | € 2.500.000 | 2024 | Details |
Spins in two-dimensional materials for tunable magnetic and optoelectronic devicesThis project aims to integrate 2D materials for efficient magnetic devices and optical communication, enabling energy-efficient data storage and transport at the nanoscale. | ERC Starting... | € 1.500.000 | 2023 | Details |
Magneto-ionic data-security device integrated on flexible substratesSECURE-FLEXIMAG aims to enhance data security by developing an advanced device using innovative materials and designs to overcome current PUF limitations and improve efficiency and scalability. | ERC Proof of... | € 150.000 | 2025 | Details |
Strain-Free All Heusler Alloy Junctions
This project aims to develop a low-power ferrimagnetic Heusler-alloy film for spintronic devices, utilizing atomic engineering to enhance magnetic properties and simplify production processes.
Layering, Understanding, Controlling and Integrating Ferroelectric Polar Textures on Silicon
The project aims to integrate topological polar textures in nanoscale ferroelectrics onto silicon platforms to enable energy-efficient, ultra-compact electronic devices through advanced engineering techniques.
Curvilinear multiferroics
This project aims to develop curvilinear multiferroics by using geometric curvature to create new materials for energy-efficient computing, enhancing memory and logic devices beyond current technologies.
Spins in two-dimensional materials for tunable magnetic and optoelectronic devices
This project aims to integrate 2D materials for efficient magnetic devices and optical communication, enabling energy-efficient data storage and transport at the nanoscale.
Magneto-ionic data-security device integrated on flexible substrates
SECURE-FLEXIMAG aims to enhance data security by developing an advanced device using innovative materials and designs to overcome current PUF limitations and improve efficiency and scalability.
Vergelijkbare projecten uit andere regelingen
Project | Regeling | Bedrag | Jaar | Actie |
---|---|---|---|---|
Ultralow power ferroelectric spintronic components for logic and artificial intelligenceUPSPRING aims to revolutionize microelectronics by advancing ultra-low energy FESO technology to reduce chip energy consumption by 1000x, enhancing performance and supporting EU semiconductor sovereignty. | EIC Transition | € 2.499.999 | 2025 | Details |
Solving the scaling challenge of the memory industry: high-speed, low-complexity and low-cost non-volatile ferroelectric memory (Fe-NVRAM) made in EUFMC aims to revolutionize the European semiconductor market by developing innovative, energy-efficient memory solutions, reducing reliance on imports and creating local jobs. | EIC Accelerator | € 2.499.999 | 2024 | Details |
Green SELf-Powered NEuromorphic Processing EnGines with Integrated VisuAl and FuNCtional SEnsingELEGANCE aims to develop eco-friendly, light-operated processing technology for energy-efficient IoT applications, utilizing sustainable materials to minimize electronic waste and environmental impact. | EIC Pathfinder | € 3.100.934 | 2024 | Details |
Ultra-High Speed memories for unprecedented cloud-computing performanceXenergic aims to revolutionize SRAM design for IoT and high-performance applications, achieving up to 90% energy savings and 3x speed, while seeking EIC Accelerator investment for market readiness. | EIC Accelerator | € 2.499.999 | 2022 | Details |
Orbital Engineering for Innovative ElectronicsOBELIX aims to enhance EU industrial sovereignty by developing sustainable, spin-based electronics that reduce reliance on external materials and environmental impact through innovative orbital moment control. | EIC Pathfinder | € 3.890.838 | 2024 | Details |
Ultralow power ferroelectric spintronic components for logic and artificial intelligence
UPSPRING aims to revolutionize microelectronics by advancing ultra-low energy FESO technology to reduce chip energy consumption by 1000x, enhancing performance and supporting EU semiconductor sovereignty.
Solving the scaling challenge of the memory industry: high-speed, low-complexity and low-cost non-volatile ferroelectric memory (Fe-NVRAM) made in EU
FMC aims to revolutionize the European semiconductor market by developing innovative, energy-efficient memory solutions, reducing reliance on imports and creating local jobs.
Green SELf-Powered NEuromorphic Processing EnGines with Integrated VisuAl and FuNCtional SEnsing
ELEGANCE aims to develop eco-friendly, light-operated processing technology for energy-efficient IoT applications, utilizing sustainable materials to minimize electronic waste and environmental impact.
Ultra-High Speed memories for unprecedented cloud-computing performance
Xenergic aims to revolutionize SRAM design for IoT and high-performance applications, achieving up to 90% energy savings and 3x speed, while seeking EIC Accelerator investment for market readiness.
Orbital Engineering for Innovative Electronics
OBELIX aims to enhance EU industrial sovereignty by developing sustainable, spin-based electronics that reduce reliance on external materials and environmental impact through innovative orbital moment control.