Development of the next generation of 3D printed EMI shielding solutions based on 2D nanomaterials inks

Introduction

With the fast development of wireless communication, especially the new 5G technology, electromagnetic interference (EMI) shielding is becoming a challenge. High-performance EMI shielding materials are urgently needed in controlling electromagnetic radiation pollution that seriously affects the normal operation of sensitive electronic apparatus and systems.

Challenges with Current Materials

Metals are the most used shielding materials but suffer from:

• Easy corrosion
• High density
• Poor processability

Despite the progress, most current research still concentrates on the solo enhancement of the EMI shielding effectiveness (SE).

Importance of Multifunctionality

To enable new EMI shielding applications for next-generation devices, the following features are also important for shielding material:

1. Multifunctionality
2. Low reflection

These characteristics can significantly improve application adaptability and reduce secondary EMI pollution, respectively. Unfortunately, most of the present EMI shielding solutions cannot simultaneously integrate these characteristics.

Need for Innovative Solutions

Therefore, pioneering alternative design and fabrication strategies for developing next-generation high-performance shielding materials beyond the usual protocols are urgently needed to meet the escalating demands of modern devices.

Miniaturization Challenges

Furthermore, as a critical component in electronic devices and equipment, EMI shielding materials also face significant challenges from the miniaturization aspect.

Potential of 2D Nanomaterials

2D nanomaterials are promising for EMI-shielding applications due to their:

• Outstanding electrical, thermal, and mechanical properties
• Versatile surface chemistry
• Favorable capability to be assembled into macroscopic architectures or serve as conductive fillers for composite fabrication

Project Aim

The aim of this project is to determine the economic and technical feasibility of using readily scalable additive manufacturing technologies for the development of highly efficient and customizable EMI shielding solutions based on two-dimensional (2D) nanosheets for electronic applications.