Photonic Integrated Circuits For Access System in Telecom

Introduction

The number of internet-enabled users, devices, and bandwidth-hungry applications is increasing constantly, and network operators are struggling to meet the demand for more bandwidth. The problem is most acutely felt by end users of fixed broadband connections, typically served by passive optical networks (PONs): speed throttling and connection drop-outs are the most-reported issues.

Challenges for Telecom Operators

Telecom operators are typically too margin-stressed to invest in entirely new infrastructure and have to maximize returns on existing PONs. Developments to deliver higher transfer rates currently focus on discrete optical components, which have reached their limits in terms of:

1. Scalability
2. Performance
3. Footprint
4. Power consumption
5. Reliability
6. Cost

The integration of optical components into Photonic Integrated Circuits (PICs) offers a new technology trajectory that will overcome these limitations, but the increasing component density this entails has challenges.

PICadvanced's Solution

Through a string of successful R&D projects conducted in world-class facilities by an expert team, PICadvanced has laid the foundation for a novel PIC design serving as a platform for an entirely new generation of optical transceivers, specifically Optical Network Units (ONUs) deployed at end user premises.

This overcomes the current limit of 2.5Gbps and offers higher bandwidths with minimal upgrades of end user hardware while fulfilling the strict requirements of the telecom sector regarding:

• Footprint
• Power consumption
• Cost

Expected Outcomes

Our demonstrator will achieve 10Gbps, open a technology roadmap towards 25Gbps/50Gbps, and enable the telecom sector to achieve:

• A better quality of service
• Higher customer satisfaction
• More efficient utilization of existing fiber optic network assets

We will also demonstrate how this new generation of fast broadband technology can be delivered to end users with a lower environmental footprint by:

• Reducing raw material input
• Achieving 40% lower hardware costs
• Achieving 20% lower energy consumption